BCM56271A0IFEBG

BCM56271A0IFEBG

$174.34
  • Description:4X2.5G+4X10G+4X2.5G SWITCH, I-TE
  • Series:-

SKU:883509661ec3 Category: Brand:

  
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Product Detailed Parameters

  • Description:4X2.5G+4X10G+4X2.5G SWITCH, I-TE
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:Switch
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

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BCM56271A0IFEBG

Overview

The BCM56271A0IFEBG is a high-performance Ethernet switch IC from Broadcom's Tomahawk series, designed for data center core and spine switching applications. It delivers a total switching capacity of 3.84 Tbps with support for port speeds ranging from 10 Gbps to 100 Gbps. The device integrates hardware-accelerated MACsec encryption for secure data transmission. It features a large on-chip buffer system to manage traffic bursts effectively. The component utilizes an industrial temperature range rating and is housed in a fine-pitch ball grid array package suitable for high-density PCB layouts.

Feature Summary

  • Hardware-accelerated MACsec encryption for line-rate security
  • Support for mixed port speeds including 10G, 25G, 40G, and 100G
  • Large shared memory architecture for advanced queue management
  • P4 programmable pipeline for flexible packet processing

Applications

  • Data center core and spine switches
  • High-performance enterprise aggregation layers
  • Cloud infrastructure networking equipment

Procurement Notes

Verify the specific suffix 'IFEBG' against official Broadcom documentation to confirm the exact temperature grade and package variant. Ensure compatibility with existing board designs regarding pinout and power requirements before procurement. Request latest revision datasheets to confirm any minor manufacturing updates or compliance changes.

Selection Notes

Select this model when MACsec hardware acceleration is required at line rate. Compare against other Tomahawk variants based on port density needs and buffer size requirements. Evaluate thermal solutions necessary for the FCBGA package in enclosed chassis environments. Confirm software support for desired network operating systems.

Part Context

This component belongs to the Broadcom Tomahawk family of switching silicon, which sets industry standards for throughput and energy efficiency. It represents a generation of chips optimized for modern data center architectures requiring low latency and high scalability. The part number indicates specific commercial/industrial grading and packaging options distinct from other series members.

Replacement Considerations

Direct pin-to-pin replacements are generally not available within the same family due to architectural differences. Consider newer Tomahawk generations (e.g., Tomahawk 4 or 5) for upgraded performance, but verify software migration paths and physical form factor constraints carefully.

BCM56271A0IFEBGBCM56271A0IFEBG
$174.34
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