BCM56302B1IEBLG

BCM56302B1IEBLG

  • Description:SWITCH
  • Series:-

SKU:a8b0cb037923 Category: Brand:

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Product Detailed Parameters

  • Description:SWITCH
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:-
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BCM56302B1IEBLG

Overview

The Broadcom BCM56302B1IEBLG is a high-performance Ethernet switch chip designed for enterprise and data center networking applications. It belongs to the Trident II family, supporting line-rate switching of 40 Gigabit Ethernet (40GbE) ports with low latency. The device integrates advanced Quality of Service (QoS) features, including traffic shaping, policing, and scheduling mechanisms to ensure deterministic performance. It supports comprehensive security functions such as ACLs and encryption offload. The component operates within standard industrial temperature ranges and utilizes a ball grid array package suitable for high-density PCB layouts.

Feature Summary

  • Supports line-rate forwarding of 40GbE interfaces with non-blocking architecture
  • Integrates hardware-based QoS for traffic prioritization and congestion management
  • Provides robust security features including access control lists and packet filtering

Applications

  • Enterprise core and aggregation switches
  • Data center spine and leaf network infrastructure
  • Service provider edge routing platforms

Procurement Notes

Verify the specific suffix 'B1IEBLG' against the official Broadcom datasheet to confirm pinout compatibility and thermal specifications. Ensure that the design includes adequate power delivery networks and thermal dissipation solutions as required by the high-power consumption profile of this class of silicon. Cross-reference the revision level with the latest errata documents before finalizing the bill of materials.

Selection Notes

Select this component when designing systems requiring dense 40GbE port counts with strict latency requirements. Evaluate the available GPIOs and management interfaces against the system's control plane needs. Consider the complexity of the required PCB stack-up and impedance matching for high-speed serial lanes during the schematic capture phase.

Part Context

This part is part of the Broadcom Trident II series, which established a benchmark for high-throughput switching in the mid-2010s. It succeeded earlier generations like the Tomahawk predecessors in specific market segments while offering improved power efficiency per port. The series remains relevant in legacy infrastructure upgrades and specialized high-performance computing interconnects.

Replacement Considerations

Direct pin-to-pin replacements are generally unavailable due to proprietary architecture differences. Upgrades may involve migrating to the Trident III or Tomahawk families, which require significant schematic and layout redesigns. Verify software driver support and licensing models for any alternative components.

BCM56302B1IEBLGBCM56302B1IEBLG

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