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The BCM56334B1KFSBLG is a Gigabit Ethernet switch integrated circuit manufactured by Broadcom Limited. It provides 24 Gigabit Ethernet ports and four 10 Gigabit Ethernet uplink ports, designed for high-density access layer applications. The component operates within standard industrial temperature ranges and supports advanced Layer 2/Layer 3 switching features including VLANs, QoS, and multicast routing. It utilizes a BGA package to ensure compact form factors in network infrastructure equipment.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm pinout compatibility and environmental ratings. Confirm RoHS compliance status and check for any Product Change Notifications that may affect lead times or material composition before finalizing procurement orders.
Select this component when designing systems requiring a balance of high port density and 10G uplink capabilities. Ensure the host PCB layout accommodates the required BGA pitch and thermal dissipation needs. Validate software SDK support for intended switching protocols during the initial design phase.
This part belongs to the Broadcom BCM56xxx series of Ethernet switching solutions. It serves as a core silicon component for building managed and unmanaged Gigabit switches. The device complements broader portfolio offerings by addressing specific throughput requirements in access layer networking segments.
Consult official Broadcom documentation for direct cross-reference part numbers. Verify functional equivalence regarding pin compatibility and register mapping before substituting with alternative silicon from other manufacturers.