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The BCM56471A0IFSBG is an RF System on a Chip (SoC) aggregation switch manufactured by Broadcom Limited. It provides a total switching capacity of 1700 Gbps, designed for high-performance telecom applications. The component operates within the industrial temperature range and utilizes Silicon technology. It is classified under wireless and RF integrated circuits, specifically targeting aggregation switch requirements in communication networks.
Verify availability through authorized distributors as stock may be limited or restricted in certain regions. Confirm factory pack quantity of 84 units when placing orders. Check for specific RoHS compliance details and ensure the ordering suffix matches required specifications. Lead times can extend significantly, potentially reaching 53 weeks; confirm current production status before finalizing procurement plans.
Select this component for applications requiring 1700 Gbps aggregation switching capabilities. Ensure the design supports industrial temperature ranges and integrates with existing RF SoC architectures. Verify compatibility with silicon-based process technologies. Consider the factory pack quantity of 84 units for inventory planning and assembly line integration requirements.
This part belongs to Broadcom's Ethernet IC and RF System on a Chip product lines. It serves as a specialized aggregation switch within the broader communication and networking ICs category. The BCM56471A0IFSBG complements other Broadcom switches like the BCM56771A0KFSBG, focusing on high-throughput telecom aggregation rather than standard port-count switching.
The component delivers a total switching capacity of 1700 Gbps.
Yes, it is specified for industrial temperature range operation.