BCM56472A0KFSBG

Overview

The BCM56472A0KFSBG is a flagship Ethernet switch chip from the Broadcom Tomahawk 3 series, designed for high-performance data centers. It delivers a single-chip throughput of 12.8Tbps with port speeds ranging from 25G to 400G. The device utilizes a 16nm process technology and features a 16MB on-chip buffer with dynamic allocation capabilities. It supports FlexPort dynamic port configuration, mixed rate support, and P4 programmability. The component operates within a commercial temperature range of 0°C to 85°C and is housed in an FCBGA package.

Feature Summary

• Supports dynamic port configuration (FlexPort) and mixed rate operation across 25G to 400G speeds.
• Features 16MB large buffer with dynamic allocation to handle burst traffic effectively.
• Enables deep packet processing customization through P4 programmability.
• Optimized architecture provides industry-leading power efficiency per bit.

Applications

• High-performance data center spine and leaf switches
• Cloud computing infrastructure interconnects
• Enterprise core network aggregation layers

Procurement Notes

Verify the manufacturer part number against official Broadcom documentation to ensure authenticity. Confirm that the specific suffix matches the required commercial temperature range and package type. Request original factory packaging seals and traceability documents to mitigate counterfeit risks. Ensure compatibility with existing board designs regarding pinout and thermal requirements before finalizing orders.

Selection Notes

Select this component when designing systems requiring 12.8Tbps switching capacity with flexible port densities. It is suitable for environments needing P4 programmability for custom forwarding logic. Consider the 16nm process and 16MB buffer size for power and latency constraints. Verify that the commercial temperature grade meets the operational environment specifications.

Part Context

This part belongs to the Broadcom Tomahawk 3 family, representing a high-end tier of Ethernet switching solutions. It succeeds earlier generations by offering higher density and improved energy efficiency. The model is specifically engineered to support the transition to 400G networks while maintaining backward compatibility with lower speed interfaces.

Replacement Considerations

Direct substitutes within the same family include other Tomahawk 3 variants with different port counts or buffer sizes. Cross-generation replacements may involve Tomahawk 4 or Jericho series chips, though these require significant architectural redesign. Always verify pin-to-pin compatibility and software stack support before considering alternatives.