BCM56820B0KFSBLG

Overview

The BCM56820B0KFSBLG is a Layer 3 Ethernet switch ASIC belonging to the Broadcom StrataXGS Tomahawk family. It delivers a switching capacity of 3.2 Tbps and integrates 128 lanes of 25 Gbps SerDes. The device supports flexible port configurations, including 32 ports at 100 GbE, 64 ports at 40/50 GbE, or 128 ports at 25 GbE. It features a configurable pipeline with port-to-port latency under 400 ns. The component utilizes an FBGA package and is designed for high-density data center applications.

Feature Summary

• Hardware acceleration for VXLAN, NVGRE, MPLS, and SPB overlay tunneling protocols
• Integrated BroadView telemetry for real-time flow statistics and congestion detection
• Support for RoCE/RoCEv2 optimized for RDMA storage networks
• Smart-Buffer technology providing dynamic cache performance advantages

Applications

• Data Center Top-of-Rack (ToR) switches connecting 25G servers
• Leaf-Spine network architecture core switching
• High-performance storage area networking
• AI training cluster interconnects

Procurement Notes

Verify the specific silicon stepping indicated by the suffix B0 against the design requirements. Confirm the FBGA package compatibility with the PCB layout. Ensure the SDK version supports the required protocol features. Check RoHS compliance status for environmental regulations. Validate authenticity through authorized distribution channels.

Selection Notes

Select this component for designs requiring 3.2 Tbps throughput with native 25G interfaces. Consider the large FBGA package size and high pin count during PCB layout planning. Evaluate thermal management solutions due to the high integration density. Compare against newer generation chips if higher bandwidth per lane is needed.

Part Context

This part belongs to the Tomahawk generation of Broadcom switch ASICs, released around 2014. It represents a significant step in integrating 25G SerDes directly onto the switch die. The B0 designation refers to the specific silicon revision within the BCM56820 product line.

Replacement Considerations

Check for availability of BCM56960 series parts for direct architectural upgrades. Verify backward compatibility with existing HiGig interface designs when considering multi-chip expansions.