BCM56855A2IFSBLG

BCM56855A2IFSBLG

  • Description:MULTI LAYER SWITCH 10G
  • Series:-

SKU:9291464e2a7a Category: Brand:

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Product Detailed Parameters

  • Description:MULTI LAYER SWITCH 10G
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:Switch
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

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BCM56855A2IFSBLG

Overview

The Broadcom BCM56855A2IFSBLG is a high-performance, multi-layer Ethernet switch chip designed for enterprise and data center applications. It delivers a switching capacity of 1.92 Tbps with a packet processing rate of 1.43 Gpps. The device integrates 32 ports of 40 Gigabit Ethernet (40GbE) and supports advanced features including hardware-based Quality of Service (QoS), traffic shaping, and comprehensive security policies. It utilizes a scalable architecture to support various port configurations and includes an integrated ARM processor for management functions.

Feature Summary

  • Integrates 32 dedicated 40GbE ports for high-density connectivity
  • Supports advanced hardware-based QoS and traffic prioritization
  • Includes integrated ARM processor for system management
  • Provides comprehensive security policy enforcement capabilities

Applications

  • Enterprise core and aggregation layer switches
  • Data center spine and leaf architectures
  • Service provider edge routing platforms

Procurement Notes

Verify the specific suffix 'A2IFSBLG' against the official Broadcom datasheet to confirm pinout, temperature range, and package details. Ensure compatibility with existing board designs regarding power delivery and thermal requirements. Confirm availability through authorized distributors as this is a specialized networking component.

Selection Notes

Select this component when high port density and low latency are required in a compact form factor. It is suitable for designs needing robust QoS without external processors. Evaluate thermal dissipation needs due to the high switching capacity within the small package footprint.

Part Context

This part belongs to the Broadcom Trident series of Ethernet switch chips, known for their high throughput and integration. It represents a generation of silicon optimized for modern data center fabrics, offering significant bandwidth compared to previous single-chip solutions.

BCM56855A2IFSBLGBCM56855A2IFSBLG

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