BCM56960B1KFSBG

BCM56960B1KFSBG

$3,569.69
  • Description:IC ETHERNET SWITCH 3.2TB DATA
  • Series:-

SKU:437336d4442d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ETHERNET SWITCH 3.2TB DATA
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:Ethernet
  • Function:Switch
  • Interface:-
  • Standards:-
  • Voltage - Supply:-
  • Current - Supply:-
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BCM56960B1KFSBG

Overview

The BCM56960B1KFSBG is a third-generation StrataXGS Tomahawk L3 Ethernet switch ASIC manufactured by Broadcom Limited. It delivers a switching capacity of 3.2 Tbps utilizing 128 integrated 25 Gbps SerDes interfaces. The device supports flexible port configurations, including 32 ports at 100 GbE, 64 ports at 40/50 GbE, or 128 ports at 25 GbE. It features a configurable pipeline with port-to-port latency under 400 ns and integrates FleXGS high-density flow processing for advanced match-action capabilities.

Feature Summary

  • Hardware-accelerated support for VXLAN, NVGRE, MPLS, and SPB overlay tunneling protocols
  • Integrated BroadView telemetry for real-time flow statistics, link health monitoring, and packet tracing
  • Smart-Buffer technology providing dynamic cache allocation to optimize performance against static buffer limitations
  • Native RoCE/RoCEv2 support optimized for storage area networks and AI training environments

Applications

  • Top-of-Rack (ToR) switches connecting 25G servers with 100G uplinks
  • Leaf-Spine fabric architectures requiring 100G full interconnectivity
  • High-performance data center aggregation and core switching nodes

Procurement Notes

Verify the specific silicon stepping indicated by the suffix 'B1' against your system requirements, as it differs from the 'B0' variant found in general documentation. Confirm package integrity upon receipt, as the large FBGA form factor requires specialized handling. Ensure compatibility with the intended Network Operating System version before deployment.

Selection Notes

Select this component when designing systems requiring native 25G connectivity without external retimers. Evaluate thermal management solutions carefully due to the high pin count and power density inherent to the 28 nm process node. Verify that the PCB stack-up supports the necessary impedance control for the extensive SerDes traces required for stable signal integrity.

Part Context

This part belongs to the Broadcom StrataXGS Tomahawk family, representing an evolution in high-throughput switching technology. It serves as a foundational building block for modern cloud infrastructure, bridging the gap between traditional 10G deployments and emerging 100G standards while maintaining backward compatibility with legacy network protocols.

Replacement Considerations

Direct functional equivalents within the same generation include the BCM56960A series. For higher throughput requirements, consider the Tomahawk 2 or later generations. Cross-family replacements require significant redesign of the board layout and software stack.

BCM56960B1KFSBGBCM56960B1KFSBG
$3,569.69
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