BCM56983B0KFSBG

Overview

The BCM56983B0KFSBG is a multi-layer switch System on Chip (SoC) manufactured by Broadcom Limited. Classified under RF System on a Chip and Wireless & RF Integrated Circuits, this component utilizes Silicon technology. The specific part number suffix B0KFSBG denotes the silicon stepping, FBGA package type, and RoHS compliance status. It is categorized as an RF SoC designed for high-density switching applications.

Feature Summary

• Multi-layer switching architecture integrated into a single System on Chip
• Supports high-speed data plane processing within a silicon-based RF SoC framework

Applications

• High-density multi-layer switching systems
• RF integrated circuit applications requiring silicon-based SoC solutions

Procurement Notes

Verify component authenticity through official manufacturer channels or authorized distributors. Confirm RoHS compliance documentation matches the SBG suffix requirements. Ensure the B0 silicon stepping aligns with design specifications. Check for any product change notices affecting availability or pinout compatibility before integration.

Selection Notes

Select this component when a silicon-based RF SoC with multi-layer switching capabilities is required. Verify that the FBGA package fits the PCB footprint constraints. Ensure the design supports the specific electrical characteristics of the B0 stepping. Compare against other Broadcom SoCs if different port densities or interface types are needed.

Part Context

This part belongs to the Broadcom RF System on a Chip portfolio, specifically within the Wireless & RF Integrated Circuits subcategory. It represents a silicon implementation of multi-layer switching technology. The B0KFSBG designation identifies it as a specific manufacturing revision within the broader BCM56983 family.