BCM56DSF

Overview

The BCM56DSF is a dual NPN bipolar junction transistor manufactured by Nexperia, housed in a TSOP-6 (SOT457/SC-74) surface-mount package. It features a maximum DC collector current of 1 A and a collector-emitter voltage rating of 80 V. The device supports a collector-base voltage of 100 V and an emitter-base voltage of 5 V. Key electrical characteristics include a power dissipation of 400 mW, a gain-bandwidth product of 155 MHz, and a collector-emitter saturation voltage of 500 mV. The component operates within a temperature range of -55 °C to +150 °C.

Feature Summary

• Dual NPN configuration integrated into a compact SC-74 plastic package for space-constrained designs.
• High collector current capability supporting up to 1 A continuous operation.
• Robust voltage ratings including 80 V collector-emitter and 100 V collector-base limits.
• Wide operating temperature range extending to +150 °C for demanding environments.

Applications

• General-purpose switching circuits
• Amplifier stages
• Driver applications for loads requiring moderate current

Procurement Notes

Verify the specific suffix 'F' against the manufacturer's official documentation to confirm tape-and-reel packaging specifications. Ensure the ordering part number matches the exact pinout and marking requirements for your PCB layout. Cross-reference with the latest datasheet revision to confirm compliance with current RoHS directives and material declarations before finalizing procurement.

Selection Notes

Select this component when a dual NPN topology is required in a small outline package. The 1 A current rating and 80 V breakdown voltage make it suitable for medium-power switching tasks. Consider the 400 mW power dissipation limit and thermal management needs for high-density boards. Verify that the 155 MHz transition frequency meets the signal speed requirements of the target application circuit.

Part Context

This device belongs to Nexperia's portfolio of standard bipolar transistors designed for general electronic applications. The SOT457 package provides a low-profile solution suitable for automated surface-mount assembly processes. It serves as a discrete alternative to integrated driver ICs in cost-sensitive designs requiring simple NPN switching functionality.

Replacement Considerations

The BCM56DSX variant shares identical electrical specifications and pinout but differs in packaging format. Verify compatibility if substituting between cut-tape and reel configurations. No other direct cross-model replacements are confirmed in available public data.