BCM5704CKFBG

BCM5704CKFBG

  • Description:IC TELECOM INTERFACE 300HBGA
  • Series:-

SKU:738403679ba9 Category: Brand:

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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE 300HBGA
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:Ethernet
  • Interface:PCI
  • Number of Circuits:2
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:300-BGA
  • Supplier Device Package:300-HBGA
  • Power (Watts):-

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BCM5704CKFBG

Overview

The BCM5704CKFBG is a single-port Gigabit Ethernet controller manufactured by Broadcom Limited. It integrates a 10/100/1000 Mbps MAC and PHY into a single package, designed for cost-effective network interface solutions. The device supports standard IEEE 802.3, 802.3u, and 802.3ab specifications. It features an integrated RJ-45 connector with magnetics, eliminating the need for external components. The component utilizes a 64-pin TQFP package and operates within a specified industrial temperature range, providing a compact footprint for embedded networking applications.

Feature Summary

  • Integrates MAC and PHY functions to reduce board space and component count
  • Includes built-in RJ-45 connector with magnetics for simplified design
  • Supports full-duplex and half-duplex operation modes
  • Compatible with standard MDIO management interfaces

Applications

  • Embedded systems requiring integrated Gigabit connectivity
  • Industrial control networks
  • Consumer electronics with network capabilities

Procurement Notes

Verify the specific suffix 'KFBG' against official Broadcom documentation to confirm package type and lead-free status. Ensure compatibility with existing PCB footprints before procurement. Check for current lifecycle status as older Ethernet controllers may face discontinuation risks. Confirm supply chain authenticity through authorized distributors only.

Selection Notes

Select this component when a single-chip solution for Gigabit Ethernet is required without external PHY dependencies. Consider the thermal performance of the TQFP package in enclosed designs. Evaluate power consumption requirements against system constraints. Verify that the integrated magnetics meet the electromagnetic interference standards for the target application environment.

Part Context

This part belongs to Broadcom's portfolio of Ethernet controllers aimed at reducing complexity in network interface card designs. It serves as a foundational component for devices needing reliable wired connectivity. The integration of passive components within the IC package distinguishes it from earlier generations requiring discrete magnetics.

Replacement Considerations

Direct pin-to-pin replacements are limited due to proprietary internal architectures. Review Broadcom's official substitution guides for compatible alternatives. Ensure any substitute maintains the same package dimensions and electrical characteristics.

BCM5704CKFBGBCM5704CKFBG

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