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The BCM82752A3IFSBG is an RF System on a Chip (SoC) manufactured by Broadcom Limited. It integrates Bluetooth Low Energy (BLE) capabilities using Silicon technology. The component is categorized under Wireless & RF Integrated Circuits and is compatible with the BCM84752 series, specifically supporting 2x10G EDC functionality. This SoC is designed for applications requiring integrated wireless connectivity within compact form factors.
Verify availability status directly with authorized distributors as supply may be restricted in certain regions. Confirm RoHS compliance details through official documentation before procurement. Ensure the specific suffix matches design requirements for temperature range and package type.
Select this component when a combined BLE and high-speed Ethernet interface solution is required. Compare against the BCM84752 baseline to ensure functional parity for 2x10G EDC designs. Validate that the Silicon-based RF implementation meets the thermal and power constraints of the target enclosure.
This part belongs to Broadcom's portfolio of RF System on a Chips, bridging wireless connectivity with wired network interfaces. It serves as a specialized variant compatible with the broader BCM84752 family, targeting dense networking and industrial IoT applications where space and pin-count efficiency are critical design drivers.
Direct substitution requires verifying electrical compatibility with the BCM84752 reference design. Check pinout alignment and register mapping if replacing legacy components. No alternative part numbers are publicly confirmed as direct equivalents.