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BD0810J50150AHF is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 800MHZ-1GHZ 50/150 0805. Review the specifications below when checking this part for your BOM.
The BD0810J50150AHF is an RF balun transformer manufactured by TTM Technologies under the Xinger series. It operates within a frequency range of 800 MHz to 1 GHz, providing signal conditioning between unbalanced and balanced circuits. The component features a 50 Ohm unbalanced impedance and a 150 Ohm balanced impedance. It exhibits a maximum insertion loss of 1.1 dB. Designed for surface mount applications, it utilizes an 0805 (2012 Metric) package. The device supports operating temperatures from -55°C to +85°C and complies with RoHS standards.
Verify the specific part number BD0810J50150AHF against official TTM Technologies documentation to confirm current availability and manufacturing status. Ensure that the required impedance configuration of 50/150 Ohms aligns with the design specifications. Confirm compliance with environmental regulations such as RoHS if applicable to the target market. Check for any updated datasheet revisions that may affect performance parameters or pinout definitions before finalizing procurement orders.
Select this component when a 50 Ohm to 150 Ohm impedance transformation is required within the 800 MHz to 1 GHz range. Consider the 0805 package size for space-constrained PCB layouts. Evaluate the insertion loss specification of 1.1 dB against system sensitivity requirements. Ensure the operating temperature range of -55°C to +85°C meets the environmental conditions of the intended application. Compare with other Xinger series baluns if different impedance ratios are needed.
This component belongs to the Xinger series of RF baluns produced by TTM Technologies. It is categorized under signal conditioning products within the broader filter and RF component portfolio. The BD0810 base designation indicates the frequency range and series family, while the suffix specifies the impedance ratio and package type. It is designed for high-volume surface mount assembly processes typical in consumer electronics and telecommunications equipment manufacturing.
Publicly confirmed substitute part numbers are not available in the provided source data. Verify compatibility with existing designs by cross-referencing electrical parameters and mechanical dimensions with alternative baluns from the same manufacturer or other suppliers offering similar 50/150 Ohm specifications.
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