BD0922J75100AHF

Balun Overview

The BD0922J75100AHF is a broadband low-profile balun transformer manufactured by TTM Technologies. It operates within a frequency range of 900 MHz to 2.2 GHz, facilitating impedance transformation between 75 Ohms and 100 Ohms. The component utilizes an SMD/SMT termination type and is housed in an 0805 (2012 metric) package. It supports board mount installation and functions reliably across a temperature range of -55°C to +85°C.

Balun Feature Summary

• Broadband operation covering 900 MHz to 2.2 GHz
• Impedance conversion between 75 Ohm and 100 Ohm systems
• Ultra-low profile surface-mount construction for compact designs

Balun Applications

• High volume manufacturing RF circuits
• Signal conditioning in wireless communication systems
• Balanced-to-unbalanced signal conversion

Balun Procurement Notes

Verify the specific datasheet version and RoHS compliance status prior to integration. Confirm that the 75/100 Ohm impedance ratio aligns with the target circuit requirements. Ensure the 0805 footprint matches the PCB layout constraints. Check for any recent packaging changes or production cycle updates from the manufacturer.

Balun Selection Notes

Select this component when a wide bandwidth from 900 MHz to 2.2 GHz is required for impedance matching between 75 and 100 Ohm lines. It serves as a high-performance alternative to traditional ceramic or lumped element baluns. The low-profile design is suitable for space-constrained applications requiring reliable board-mounted signal transformation.

Balun Part Context

This part belongs to the Xinger series of signal conditioning components produced by TTM Technologies. It is categorized under RF transformers and baluns, designed for efficient signal processing in modern electronic devices. The product line emphasizes low profile and high performance for various frequency bands.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.