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The BD11670GWL-E2 is a DPDT USB switch IC supporting USB 2.0 high-speed data transmission. It features low on-resistance and low capacitance for signal integrity. The device supports dual power supply architectures, accepting input from both VBUS (3.8V to 28V) and VCC (3.0V to 5.5V). Each terminal includes discharge protection circuits. Key electrical parameters include an ON resistance of 5 ohms, an operating temperature range of -40°C to 85°C, and a package size of 1.2x1.6 mm with a thickness of 0.57 mm in the UCSP50L1C package.
Verify the specific ordering suffix E2 against the manufacturer's current datasheet to confirm package type and tape/reel specifications. Ensure compatibility with RoHS directives if required by the target market regulations. Cross-reference the UCSP50L1C footprint dimensions during PCB layout design to prevent assembly errors.
Select this component when a DPDT configuration is required for USB 2.0 applications with low insertion loss constraints. The wide VBUS voltage tolerance up to 28V allows flexibility in power delivery scenarios. Verify that the 5-ohm on-resistance meets the voltage drop requirements of the specific application circuit before finalizing the design.
This part belongs to ROHM Semiconductor's USB switch IC portfolio, designed for compact mobile devices. The UCSP50L1C package represents one of the smallest form factors available for this function, aiding in space-constrained designs. It complements other interface components in systems requiring reliable USB connectivity management.
Check for direct substitutes within the BD116xx series that maintain the UCSP50L1C footprint and DPDT functionality. Verify pin-to-pin compatibility and identical electrical characteristics such as on-resistance and capacitance values before substitution.