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BD2326L50200AHF is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 2.3GHZ-2.6GHZ 50/200 0603. Review the specifications below when checking this part for your BOM.
The BD2326L50200AHF is an ultralow profile surface-mount balun manufactured by TTM Technologies. It operates within a frequency range of 2.3GHz to 2.6GHz, providing impedance transformation between 50 Ohms unbalanced and 200 Ohms balanced ports. The component utilizes a compact 0603 (1608 Metric) package designed for board mounting. Key electrical specifications include a maximum insertion loss of 0.9dB and a phase difference of 3 degrees. It is suitable for high-frequency signal conditioning applications requiring minimal footprint.
Verify the specific suffix AHF against official manufacturer documentation to confirm RoHS compliance status and halogen-free characteristics. Ensure the ordering part number matches the exact frequency and impedance requirements. Cross-reference with the latest datasheet revision to confirm active production status and availability constraints before finalizing procurement plans.
Select this component when a 0603 footprint is required for 2.4GHz ISM band applications. It is appropriate for designs needing 50/200 Ohm impedance transformation with strict size limitations. Consider the 0.9dB insertion loss and 3-degree phase balance when evaluating signal integrity requirements for high-speed digital or RF analog paths.
This balun belongs to the Xinger series of signal conditioning components produced by TTM Technologies. It is categorized under RF filters and baluns, specifically designed for surface-mount technology. The product line focuses on miniaturized solutions for modern wireless communication hardware, replacing larger traditional transformer-based designs.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with existing circuit designs if considering alternative manufacturers.
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