BD2326L50200AHF2

Balun Overview

The BD2326L50200AHF2 is an ultralow profile balun manufactured by TTM Technologies under the Xinger brand. It operates within a frequency range of 2.3 GHz to 2.6 GHz, providing signal conditioning between 50 Ohm and 200 Ohm impedances. The component utilizes SMD/SMT termination and is housed in a compact 0603 (1608 metric) package. Designed for board mounting, it supports surface mount assembly processes.

Balun Feature Summary

• Converts balanced signals to unbalanced signals across specified RF frequencies
• Maintains impedance transformation between 50 Ohm and 200 Ohm ports
• Features an ultralow profile design suitable for space-constrained applications

Balun Applications

• RF signal conditioning in wireless communication systems
• Impedance matching in high-frequency circuit designs
• Balanced-to-unbalanced conversion in RF front-end modules

Balun Procurement Notes

Verify the specific manufacturer part number BD2326L50200AHF2 against official TTM Technologies documentation to confirm electrical characteristics and mechanical dimensions. Ensure compatibility with 0603 footprint requirements and 2.3-2.6 GHz operational bands before integration into final designs.

Balun Selection Notes

Select this component when designing circuits requiring precise 50 to 200 Ohm impedance transformation at 2.3-2.6 GHz. Consider the 0603 package size for layout constraints and verify thermal operating ranges align with system requirements.

Balun Part Context

This balun belongs to the Xinger series of RF components produced by TTM Technologies. These devices are engineered for high-performance signal integrity in modern electronic systems, offering reliable balanced-to-unbalanced conversion capabilities within standardized surface-mount form factors.

Balun Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.