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BD2425N50AIR is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 4SMD NO LEAD. Review the specifications below when checking this part for your BOM.
Balun specifications for BD2425N50AIR
- Description：BALUN 4SMD NO LEAD
- Series：-
- Mfr：TTM Technologies, Inc.
- Package：Tape & Reel (TR),Cut Tape (CT)
- Frequency Range：-
- Impedance - Unbalanced/Balanced：-
- Phase Difference：-
- Insertion Loss (Max)：-
- Return Loss (Min)：-
- Package / Case：4-SMD, No Lead
- Mounting Type：Surface Mount
Balun datasheet and documents for BD2425N50AIR
Balun Overview
The BD2425N50AIR is an ultra-low profile balun manufactured by TTM Technologies under the Xinger brand. Designed for signal conditioning, it operates within a frequency range of 2.3 GHz to 2.6 GHz. The component provides impedance transformation between 50 Ohms and features a typical insertion loss of 0.4 dB. It utilizes SMD/SMT termination and is housed in a compact 0404 (1010 metric) package. The device supports board mount installation and functions reliably across a temperature range from -55°C to +85°C.
Balun Feature Summary
- Ultra-low profile design suitable for space-constrained applications
- Balanced-to-unbalanced signal conversion capability
- Compact surface-mount footprint for automated assembly
Balun Applications
- Wireless communication modules
- RF front-end circuitry
- Signal conditioning networks
Balun Procurement Notes
Verify that the specific suffix 'AIR' aligns with the required tape-and-reel packaging configuration for automated manufacturing processes. Confirm that the 0404 package dimensions match the target PCB layout constraints. Ensure the operating temperature range meets the environmental requirements of the final assembly. Cross-reference the datasheet specifications against the intended RF performance criteria before integration.
Balun Selection Notes
Select this component when a low-profile solution is required for 2.4 GHz ISM band applications. Consider the 0.4 dB insertion loss specification for efficiency-critical designs. Evaluate the 50 Ohm impedance matching against system requirements. Assess the thermal stability provided by the specified operating temperature range for harsh environments.
Balun Part Context
This part belongs to the Xinger series of passive components produced by TTM Technologies. It falls under the broader category of signal conditioning devices used in radio frequency systems. The manufacturer specializes in RF microwave components and advanced interconnect products for industrial and commercial markets.
Balun Replacement Considerations
Consult official documentation for verified substitute part numbers. Generic equivalents may not replicate the specific insertion loss or profile characteristics.
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