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BD3150L50100AHF is listed in the Balun range at ChipApex. The manufacturer field lists TTM Technologies, Inc.. Its product description is BALUN 3.1GHZ-5GHZ 50/100 0603. Review the specifications below when checking this part for your BOM.
The BD3150L50100AHF is an ultralow profile RF balun manufactured by TTM Technologies under the Xinger brand. Designed for signal conditioning, this component operates within a frequency range of 3.1 GHz to 5.0 GHz. It provides impedance transformation between 50 Ohms and 100 Ohms. The device features a maximum insertion loss of 0.8 dB and a minimum return loss of 12 dB. It utilizes a 0603 (1608 metric) surface-mount package with SMD/SMT termination. The unit supports board mounting and functions reliably across an operating temperature range from -55°C to +85°C.
Verify the specific suffix 'L' against the manufacturer datasheet to confirm the 0603 package variant, as other suffixes may indicate different physical dimensions or electrical tolerances. Ensure compatibility with RoHS standards if required by the target market regulations. Confirm that the 100 Ohm balanced port aligns with the system's differential input requirements before finalizing the procurement order.
Select this component when a compact footprint is critical for high-frequency applications. The 0603 package offers a balance between size and performance. Consider the 0.8 dB insertion loss specification for power-sensitive designs. Verify that the 100 Ohm balanced impedance matches the downstream circuitry. The wide temperature range ensures stability in harsh environments.
This part belongs to the Xinger series of RF baluns produced by TTM Technologies. It is specifically engineered for ultra-low profile requirements in modern electronics. The BD3150 base model family includes various package options, with this specific variant optimized for 0603 surface mount technology.
BD3150N50100AHF: Offers similar electrical performance but uses a 0404 package instead of 0603.
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