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The BD53E26G-MTR is a linear voltage regulator manufactured by Rohm Semiconductor. It provides a fixed output voltage of 2.6V with a maximum load current capability of 150mA. The device operates within an input voltage range of 2.7V to 5.5V. Key electrical characteristics include a typical dropout voltage of 200mV at full load and a line regulation of 0.04%/V. The unit features built-in protection mechanisms including thermal shutdown and current limit functionality to ensure reliable operation under various conditions.
Verify the complete part number including suffixes such as MTR, which indicates tape and reel packaging configuration. Confirm that the specified output voltage matches system requirements exactly, as this variant is fixed at 2.6V. Ensure compatibility with available input voltage ranges before procurement. Check datasheet revisions for any updates to pin configurations or electrical specifications prior to finalizing orders.
Select this component when a fixed 2.6V output is required with moderate current demands up to 150mA. Consider its low dropout performance if input voltage margins are tight relative to the output requirement. Evaluate thermal management needs based on expected load currents and ambient temperatures. Verify that the package type suits the PCB layout constraints and manufacturing processes in use.
This regulator belongs to Rohm's series of low-dropout linear voltage regulators designed for portable applications. These components typically offer high PSRR and low quiescent current to extend battery life. The BD53E26G-MTR shares functional similarities with other variants in the family but differs in its specific fixed output voltage setting, distinguishing it from adjustable or differently valued counterparts.
Direct replacements must match the 2.6V fixed output, 150mA current rating, and compatible package. Verify equivalent electrical parameters such as dropout voltage and protection features. Cross-reference with manufacturer databases for updated equivalents ensuring pin compatibility and thermal performance alignment.