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The BD70H12G-2CTR is an automotive-grade voltage detector IC manufactured by ROHM Semiconductor. It features a typical over-voltage detection threshold of 1.2 V with ±4.17% precision. The device operates within a power supply range of 0.8 V to 6 V and utilizes an open-drain output type. It consumes 0.27 µA in the ON state and 0.3 µA in the OFF state. The component supports a reset active state high configuration without manual reset or watchdog timer functions. It is housed in an SSOP5 package and is qualified under AEC-Q100 standards for Grade 1 automotive applications.
Verify that the specific suffix 'CTR' corresponds to the taping packaging format containing 3000 units per reel as documented. Confirm the part meets the FS supportive category requirements if functional safety analysis support is necessary for the target application. Ensure the open-drain output configuration aligns with the external pull-up resistor requirements of the host system interface.
Select this component when a low voltage detection threshold near 1.2 V is required for automotive systems. The open-drain output necessitates an external pull-up resistor, unlike CMOS output variants. Consider the ±4.17% precision tolerance against system voltage margins. The absence of a watchdog timer and manual reset pin simplifies the design but limits advanced fault handling capabilities compared to more complex supervisory ICs.
This part belongs to the BD70Hxx-2C series of nano energy™ voltage detectors designed for automotive environments. It complements the BD73Hxx-2C series which offers CMOS outputs instead of open-drain. Both series share similar low power characteristics and package dimensions, allowing designers to choose based on output drive requirements while maintaining consistent footprint and thermal performance across the product family.
BD70H12G-2C serves as the standard tape and reel alternative within the same series. For CMOS output requirements, the BD73H12G-2CTR provides equivalent detection voltage with different output topology. Cross-reference package dimensions and electrical specifications before substitution to ensure compatibility with existing PCB layouts and circuit interfaces.