BD7185AGWL-E2

Overview

The BD7185AGWL-E2 is a mobile phone power management LSI manufactured by ROHM Semiconductor. It features five high-efficiency Buck converters and twelve CMOS-type LDOs, with output voltages adjustable via I²C interface. The device supports power ON/OFF control through I²C or external pins, including sequence management. Integrated peripherals include a 32.768kHz oscillator, analog switch, TCXO buffer, and SIM card interface. Operating within a voltage range of 2.6V to 5.5V, it functions between -35°C and 85°C in a compact 3.8mm x 3.8mm CSP package.

Feature Summary

• Integrates five-channel high-efficiency Buck converters and twelve-channel CMOS-type LDOs for comprehensive power regulation.
• Provides flexible power control with ON/OFF sequencing managed via I²C interface or external pins.
• Includes integrated peripheral interfaces such as a 32.768kHz oscillator, analog switch, and SIM card interface.

Applications

• Mobile phones
• Smartphones

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix E-2 matches design requirements. Check current lifecycle status as manufacturing discontinuation notices may apply. Ensure compliance with RoHS standards and operating temperature ranges for target applications. Validate package dimensions against PCB footprint specifications before integration.

Selection Notes

Select this component for mobile applications requiring integrated power management with extensive I²C programmability. Consider the UCSP50L3C package size for space-constrained designs. Verify that the input voltage range of 2.6V to 5.5V aligns with system power rails. Ensure compatibility with the required I²C device address configuration via the ADRS pin.

Part Context

This part belongs to ROHM's specialized power management IC series designed for portable electronics. It consolidates multiple regulator channels and peripheral functions into a single small-footprint package. The series targets high-density circuit board layouts common in modern mobile devices, reducing component count and assembly complexity.

Replacement Considerations

Public documentation indicates manufacturing discontinuation for the BD7185AGWL model. No officially confirmed substitute part numbers are provided in the source material. Designers should consult ROHM Semiconductor directly for end-of-life management and alternative recommendations.