BDE-RFM208P-2.4-UA

RF Transceiver Modules And Modems Overview

The BDE-RFM208P-2.4-UA is a multi-band wireless module manufactured by BDE Technology, built on the Texas Instruments CC1352R chip. It supports Sub-1GHz and 2.4GHz frequency bands with multiprotocol capabilities including Thread, Zigbee, and Bluetooth 5.0 Low Energy. The module features an integrated power amplifier for enhanced range and operates in a compact surface-mount package designed for IoT applications.

RF Transceiver Modules And Modems Feature Summary

• Supports multi-band operation across Sub-1GHz and 2.4GHz frequencies
• Enables multiprotocol communication including Thread, Zigbee, and BLE 5.0
• Integrates a power amplifier to extend wireless transmission range

RF Transceiver Modules And Modems Applications

• IoT sensor networks requiring long-range connectivity
• Smart home automation systems using Zigbee or Thread
• Industrial monitoring devices utilizing Sub-1GHz bands

RF Transceiver Modules And Modems Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct configuration. Confirm that the component matches the intended protocol support and frequency band requirements for your design. Check RoHS compliance status through the official datasheet before procurement.

RF Transceiver Modules And Modems Selection Notes

Select this module when both Sub-1GHz and 2.4GHz coverage are required within a single device. It is suitable for designs needing multiprotocol flexibility without external RF switches. Ensure the host MCU can handle the processing load for concurrent protocol stacks.

RF Transceiver Modules And Modems Part Context

This part belongs to the BDE-RFM208P series of multi-band modules. It shares the core CC1352R-based architecture with other variants but differs in specific frequency band configurations and interface options. The -2.4 designation indicates its primary focus on 2.4GHz operations alongside Sub-1GHz support.

RF Transceiver Modules And Modems Replacement Considerations

Direct substitutes include other BDE Technology modules based on the CC1352R chip, such as the BDE-RFM208P-S1-UA, provided they meet the same multiprotocol and frequency requirements. Verify pin compatibility and firmware support before substitution.