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BF100-44-A-C-0-0625-N-D is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists GCT. Its product description is 44W, 2MM PITCH SOCKET, DIL, SMT,. Review the specifications below when checking this part for your BOM.
The GCT BF100-44-A-C-0-0625-N-D is a board-to-board receptacle connector from the BF100 series. It features 44 positions arranged in a dual inline (DIL) configuration with two rows. The connector utilizes a 2.00mm pitch for mating contacts and maintains an identical 2.00mm row spacing. Designed for surface mount technology (SMT), this vertical socket employs gold flash plating on its contacts to ensure reliable signal transmission. The component is engineered for high-density interconnect applications requiring robust mechanical stability and consistent electrical performance.
Verify the specific ordering suffixes against the manufacturer's official datasheet to confirm exact pin count, plating thickness, and mounting style. Ensure compatibility with mating header specifications regarding pitch and row spacing before procurement. Cross-reference part numbers with authorized distributors to avoid counterfeit components.
Select this component when a 44-position vertical board-to-board interface is required. Confirm that the PCB layout supports the 2.00mm pitch and dual-row footprint. Evaluate thermal requirements and mating force constraints relative to the application environment. Ensure the selected variant matches the necessary mechanical retention and entry direction specifications.
This receptacle belongs to the GCT BF100 series of board-to-board connectors. The series offers various position counts and configurations to support diverse electronic assembly needs. The BF100 line is characterized by its precision engineering and suitability for modern high-density electronics manufacturing.
Direct substitutes must match the 44-pin count, 2.00mm pitch, dual-row DIL format, and SMT vertical mounting type. Verify that alternative components offer equivalent contact material properties and mechanical dimensions to ensure seamless integration without PCB redesign.
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