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The BFCN-8650+ is an LTCC bandpass filter with a center frequency of 8.65 GHz and a bandwidth of 200 MHz, covering the range from 8550 to 8750 MHz. It operates at a 50 Ohm impedance and features a 4-SMD, no lead package (FV1206-4). The device offers low insertion loss, typically 2.0 dB, and provides good rejection at band reject edges. Designed for RF and microwave applications, it ensures signal isolation and noise rejection in compact form factors.
Verify the specific datasheet version and electrical performance graphs directly from Mini-Circuits or authorized distributors before integration. Confirm that the FV1206-4 package dimensions align with your PCB layout requirements. Ensure operating conditions remain within the specified thermal and voltage limits to maintain the typical 2.0 dB insertion loss and rejection performance documented in the official component specifications.
Select this component when a narrow 200 MHz bandwidth centered at 8.65 GHz is required for S-band applications. The LTCC construction offers a balance of size and performance, making it suitable for high-frequency signal processing where low insertion loss is critical. Consider the 50 Ohm impedance match for standard RF system integration and verify that the surface-mount termination style fits the manufacturing capabilities of the target assembly line.
This component belongs to the BFCN series of ceramic filters manufactured by Mini-Circuits. These filters are designed for high-performance RF and microwave applications, leveraging LTCC technology to achieve small sizes and reliable operation. The series supports various center frequencies and bandwidths, providing engineers with standardized solutions for signal conditioning and isolation in complex electronic systems.
Consult Mini-Circuits documentation for direct substitutes within the BFCN series or alternative LTCC filters with matching 8.65 GHz center frequency and 200 MHz bandwidth. Verify that any replacement maintains the 50 Ohm impedance and compatible FV1206-4 or equivalent SMD package dimensions to ensure seamless PCB integration without redesign.