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BG11C is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists BeRex Corp. Its product description is IC AMP 5G 50MHZ-4GHZ SOT89-3. Review the specifications below when checking this part for your BOM.
The BG11C is a high-performance InGaP HBT MMIC gain block designed for operation within the 50 MHz to 4 GHz frequency range. It features an internally matched 50-ohm interface and utilizes patented temperature compensation technology to ensure stable performance across varying thermal conditions. The device offers a typical gain of approximately 20 dB with a noise figure ranging from 3.8 to 4.5 dB. Output power capabilities extend up to 17.3 dBm, supporting cascaded configurations for system integration.
Verify the specific manufacturer source, as BeRex Corporation assets may have been acquired or rebranded. Confirm that the SOT-89-3 package marking matches the required part number. Ensure the datasheet reflects current electrical specifications, particularly regarding gain and noise figure tolerances, before finalizing component selection for production.
Select this component when a broadband RF amplifier covering 50 MHz to 4 GHz is required. The internal 50-ohm matching reduces external component count. Consider the cascadable nature if higher gain is needed. Verify thermal management requirements due to the patented compensation feature, ensuring the operating environment aligns with the specified temperature ranges for optimal noise performance.
This device belongs to the family of InGaP HBT monolithic microwave integrated circuits (MMICs) produced by BeRex Corporation. These components are engineered for radio frequency applications requiring high gain and low noise. The BG11C specifically targets wireless communication standards, providing a compact solution for signal conditioning in modern mobile network infrastructure and consumer electronics.
Publicly confirmed substitute part numbers are not available in the provided documentation. When evaluating alternatives, compare key parameters such as frequency range, gain flatness, and noise figure. Ensure the replacement device supports similar packaging dimensions and pinout configurations to maintain board layout compatibility without redesigning the surrounding circuitry.
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