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BGA 700L16 E6327 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP GSM 500MHZ-6GHZ TSLP7-1. Review the specifications below when checking this part for your BOM.
The BGA 700L16 E6327 is a silicon-based RF amplifier manufactured by Infineon Technologies. It operates within the frequency range of 500 MHz to 6 GHz and utilizes a TSLP-7-1 package. Key electrical specifications include a noise figure of 0.95 dB, a maximum power dissipation of 250 mW, and an operating temperature range from -40°C to +125°C. The device is designed for surface-mount installation and supports wireless communication applications.
Verify the specific suffix and tape-and-reel configuration against official Infineon documentation before ordering. Confirm that the TSLP-7-1 package dimensions match your PCB footprint requirements. Ensure compatibility with your manufacturing process for surface-mount assembly. Check for any recent lifecycle status updates or alternative recommendations directly from the manufacturer.
Select this component when a wide operational bandwidth covering 500 MHz to 6 GHz is required. The low noise figure makes it suitable for sensitive receiver front-ends. Consider the thermal management capabilities provided by the exposed pad design in the TSLP-7-1 package for high-power density applications.
This part belongs to the BGA series of radio frequency integrated circuits from Infineon Technologies. These components are typically used in mobile communication systems and wireless infrastructure. The E6327 suffix denotes a specific tape-and-reel packaging variant optimized for automated surface-mount production lines.
Consult official Infineon substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully if considering third-party equivalents.
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