BGA2771,115

BGA2771,115

$0.27
  • Description:IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:c9102681127e Category: Brand:

  
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Product Detailed Parameters

  • Description:IC AMP ISM 20MHZ-2.5GHZ 6TSSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency:20MHz ~ 2.5GHz
  • P1dB:12.1dBm
  • Gain:21.4dB
  • Noise Figure:4.5dB
  • RF Type:ISM
  • Voltage - Supply:3V ~ 4V
  • Current - Supply:33.3mA
  • Test Frequency:1GHz
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Supplier Device Package:6-TSSOP
  • Grade:-
  • Qualification:-

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BGA2771,115

Overview

The BGA2771,115 is a silicon monolithic microwave integrated circuit (MMIC) wideband amplifier manufactured by NXP USA Inc. It features an internal matching circuit and is housed in a 6-pin SOT-363 surface-mount plastic package. The device operates within a frequency range of 20 MHz to 2.5 GHz. Key electrical specifications include a P1dB output power of 12.1 dBm and an operating supply current of 50 mA. The component supports an operating temperature range from -40°C to +85°C.

Feature Summary

  • Integrated MMIC design with built-in internal matching circuits for simplified implementation
  • Wideband operational capability covering frequencies from 20 MHz to 2.5 GHz
  • Compact 6-pin SOT-363 surface-mount package suitable for space-constrained applications

Applications

  • ISM band signal amplification
  • General-purpose RF amplification in wireless communication systems
  • Wideband receiver front-end stages

Procurement Notes

Verify the obsolete status of this component before initiating procurement processes. Confirm availability through authorized distributors or secondary market suppliers, as standard manufacturing channels may no longer support new orders. Ensure that the specific suffix '115' matches the required reel packaging configuration. Cross-reference the datasheet revision date to guarantee compatibility with current design requirements and regulatory standards.

Selection Notes

Select this component when a wideband amplification solution is required across the 20 MHz to 2.5 GHz spectrum. Consider the 12.1 dBm P1dB specification for linearity requirements in the target application. Evaluate the 50 mA supply current against power budget constraints. The SOT-363 package dictates PCB layout considerations regarding thermal dissipation and pin pitch alignment during assembly.

Part Context

This part belongs to NXP's portfolio of MMIC wideband amplifiers designed for versatile RF applications. It serves as a general-purpose amplifier suitable for various frequency bands within its specified range. The device integrates passive components internally to reduce external circuit complexity. It represents a specialized solution for engineers requiring broad bandwidth performance in a compact form factor.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Due to the obsolete status, alternative sourcing must rely on existing stock or equivalent generic wideband amplifiers with matching electrical parameters.

BGA2771,115BGA2771,115
$0.27
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