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The BGA2771,115 is a silicon monolithic microwave integrated circuit (MMIC) wideband amplifier manufactured by NXP USA Inc. It features an internal matching circuit and is housed in a 6-pin SOT-363 surface-mount plastic package. The device operates within a frequency range of 20 MHz to 2.5 GHz. Key electrical specifications include a P1dB output power of 12.1 dBm and an operating supply current of 50 mA. The component supports an operating temperature range from -40°C to +85°C.
Verify the obsolete status of this component before initiating procurement processes. Confirm availability through authorized distributors or secondary market suppliers, as standard manufacturing channels may no longer support new orders. Ensure that the specific suffix '115' matches the required reel packaging configuration. Cross-reference the datasheet revision date to guarantee compatibility with current design requirements and regulatory standards.
Select this component when a wideband amplification solution is required across the 20 MHz to 2.5 GHz spectrum. Consider the 12.1 dBm P1dB specification for linearity requirements in the target application. Evaluate the 50 mA supply current against power budget constraints. The SOT-363 package dictates PCB layout considerations regarding thermal dissipation and pin pitch alignment during assembly.
This part belongs to NXP's portfolio of MMIC wideband amplifiers designed for versatile RF applications. It serves as a general-purpose amplifier suitable for various frequency bands within its specified range. The device integrates passive components internally to reduce external circuit complexity. It represents a specialized solution for engineers requiring broad bandwidth performance in a compact form factor.
No public confirmed substitute part numbers are available in the provided documentation. Due to the obsolete status, alternative sourcing must rely on existing stock or equivalent generic wideband amplifiers with matching electrical parameters.