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BGF110E6327XT is listed in the Specialized ICS range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FILTER HSMMC ESD PROT 24WLP. Review the specifications below when checking this part for your BOM.
The BGF110 is an ESD protection device for SD Card interfaces, housed in a green WLP-24-2 wafer level package with SnAgSu solder balls. It provides integrated protection up to 15 kV contact discharge per IEC61000-4-2 and includes RF filtering for low cross-talk. Electrical characteristics include series resistors ranging from 32 Ω to 611 Ω and line capacitance between 11.5 pF and 20 pF at 5 V bias. The component operates within a temperature range of -40 °C to +85 °C.
Verify the specific ordering suffix against Infineon documentation to confirm package type and tape/reel specifications. Ensure compatibility with the WLP-24-2 footprint and 400 µm ball pitch during procurement planning.
Select this component for applications requiring combined ESD protection and signal integrity filtering on SD Card lines. Verify that the maximum operating current of 113 mA and thermal dissipation requirements are met by the PCB layout.
The BGF110 belongs to the Small Signal Discretes category, specifically designed as a specialized IC for interface protection. It utilizes a wafer level package to minimize board space while maintaining high performance standards for consumer electronics.
No public confirmed substitute part numbers are available in the provided documentation.
The external IOs (A4, A5, B4, B5, C4, C5, D4, D5, E4, E5) support up to 15 kV contact discharge according to IEC61000-4-2.
The line capacitance ranges from 13.5 pF at 0 V to 11.5 pF at 5 V, showing very low sensitivity to bias voltage changes.
The typical value for resistor R21 is 470 kΩ, with a minimum of 329 kΩ and a maximum of 611 kΩ.
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