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BGM13S32F512GN-V2R is listed in the RF Transceiver Modules And Modems range at ChipApex. The manufacturer field lists Silicon Labs. Its product description is RF TXRX MODULE BLUETOOTH SMD. Review the specifications below when checking this part for your BOM.
The BGM13S32F512GN-V2R is a Bluetooth 5.0 System-in-Package module from Silicon Labs, designed for wireless connectivity applications. It integrates an ARM Cortex-M4 core with 512 kB of flash memory and 64 kB of RAM. The module operates within a frequency range of 2.4 GHz to 2.4835 GHz, utilizing GFSK modulation. It delivers an output power of 18 dBm and achieves a receiver sensitivity of -90.2 dBm at a data rate of 2 Mb/s. Electrical specifications include a supply voltage range of 1.8 V to 3.8 V and an operating temperature range of -40°C to +85°C. Physical dimensions are 6.5 mm x 6.5 mm x 1.4 mm.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and moisture sensitivity level (MSL) ratings prior to assembly. Ensure storage conditions meet specified humidity requirements to prevent package degradation. Cross-reference the full part number to confirm specific firmware and hardware revisions.
Select this module when high output power and moderate processing capability are required in a compact form factor. The integrated chip antenna simplifies PCB layout compared to RF pin variants. Verify that the host system supports the necessary serial interface protocols and provides adequate power delivery within the specified voltage range.
This component belongs to the BGM13S series of Blue Gecko modules. It shares the same physical footprint and core architecture with other variants in the family, differing primarily in internal memory configuration and antenna type. The S suffix typically denotes a specific package style within the broader product line.
Publicly confirmed substitute part numbers are not available in the provided documentation. Consult official Silicon Labs lifecycle notices for end-of-life status or recommended alternative components.
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