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BGM240PA32VNN3R is listed in the RF Transceiver Modules And Modems range at ChipApex. The manufacturer field lists Silicon Labs. Its product description is RF TXRX MODULE BT PCB SECURE VA. Review the specifications below when checking this part for your BOM.
The BGM240PA32VNN3R is a Bluetooth Low Energy 5.4 wireless module from Silicon Labs, built on the EFR32BG24 SoC with an ARM Cortex-M33 core. It operates at 2.4 GHz with a data rate of 2 Mbps and delivers +20 dBm output power. The module features 1.5 MB Flash and 256 kB RAM, supporting interfaces including GPIO, I2C, SPI, UART, and USART. It functions within a 1.8 V to 3.8 V supply range and withstands temperatures from -40°C to +105°C.
Verify the specific suffix against official documentation to confirm pinout and antenna configuration. Ensure compatibility with the target application's voltage requirements and thermal environment. Confirm that the selected variant meets all necessary regulatory certifications for the intended deployment region.
Choose this module when Bluetooth 5.4 support and high transmit power are required. Consider the integrated PCB trace antenna design for compact form factors. Evaluate the extensive peripheral interface availability against system connectivity needs.
This component belongs to the Wireless Gecko BGM240P series, designed for secure and efficient wireless connectivity. It utilizes the EFR32BG24 silicon platform, offering a balance of processing power and energy efficiency suitable for diverse IoT applications requiring robust Bluetooth performance.
Public confirmed substitute part numbers: BGM240PA22VNA3, MGM240PA32VNN3R
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