RF Amplifiers BGM687U50E6327XUMA1 product image

BGM687U50E6327XUMA1

$2.16
  • Description:IC AMP 7XLNA BANK OUTPUT CROSS-S
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:adff99cc5553 Category: Brand:

  
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BGM687U50E6327XUMA1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP 7XLNA BANK OUTPUT CROSS-S. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for BGM687U50E6327XUMA1

  • Description:IC AMP 7XLNA BANK OUTPUT CROSS-S
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency:-
  • P1dB:-
  • Gain:-
  • Noise Figure:-
  • RF Type:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Test Frequency:-
  • Mounting Type:-
  • Package / Case:-
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RF Amplifiers datasheet and documents for BGM687U50E6327XUMA1

BGM687U50E6327XUMA1

RF Amplifiers Overview

The BGM687U50E6327XUMA1 is a silicon-based low noise amplifier MMIC from Infineon Technologies, designed for sub-3 GHz wireless applications. It operates within a frequency range of 600 MHz to 2.7 GHz and delivers a typical gain of 21 dB with a noise figure of 0.8 dB. The device functions on a single 1.2 V supply voltage while consuming only 80 uA of current. Packaged in a compact BGA-50 format suitable for surface mount technology, it supports an operating temperature range from -30°C to +85°C.

RF Amplifiers Feature Summary

  • Integrated low noise amplifier MMIC optimized for high sensitivity reception
  • Operates efficiently on a single 1.2 V power supply rail
  • Compact BGA-50 package design facilitates dense PCB layout integration

RF Amplifiers Applications

  • Wireless infrastructure base station front-end modules
  • Sub-3 GHz cellular communication systems
  • IoT and LPWAN receiver chains

RF Amplifiers Procurement Notes

Verify the specific suffix E6327 against official Infineon documentation to confirm pinout and electrical characteristics match your schematic requirements. Confirm moisture sensitivity level handling procedures during assembly. Ensure the BGA-50 footprint matches your board design exactly before placing orders.

RF Amplifiers Selection Notes

Select this component when designing receivers for sub-3 GHz bands requiring minimal power consumption and low noise performance. The BGA-50 package is suitable for space-constrained designs. Verify thermal management capabilities within the specified -30°C to +85°C operational range for your target environment.

RF Amplifiers Part Context

This part belongs to Infineon's portfolio of RF amplifiers targeting wireless infrastructure and cellular markets. It serves as a critical component in signal chain architectures where signal integrity and power efficiency are paramount for sub-3 GHz frequency operations.

RF Amplifiers Replacement Considerations

Consult official Infineon substitution guides for verified alternatives. Cross-reference technical specifications carefully to ensure compatibility with existing system requirements.

BGM687U50E6327XUMA1BGM687U50E6327XUMA1
$2.16
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