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BGM687U50E6327XUMA1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP 7XLNA BANK OUTPUT CROSS-S. Review the specifications below when checking this part for your BOM.
The BGM687U50E6327XUMA1 is a silicon-based low noise amplifier MMIC from Infineon Technologies, designed for sub-3 GHz wireless applications. It operates within a frequency range of 600 MHz to 2.7 GHz and delivers a typical gain of 21 dB with a noise figure of 0.8 dB. The device functions on a single 1.2 V supply voltage while consuming only 80 uA of current. Packaged in a compact BGA-50 format suitable for surface mount technology, it supports an operating temperature range from -30°C to +85°C.
Verify the specific suffix E6327 against official Infineon documentation to confirm pinout and electrical characteristics match your schematic requirements. Confirm moisture sensitivity level handling procedures during assembly. Ensure the BGA-50 footprint matches your board design exactly before placing orders.
Select this component when designing receivers for sub-3 GHz bands requiring minimal power consumption and low noise performance. The BGA-50 package is suitable for space-constrained designs. Verify thermal management capabilities within the specified -30°C to +85°C operational range for your target environment.
This part belongs to Infineon's portfolio of RF amplifiers targeting wireless infrastructure and cellular markets. It serves as a critical component in signal chain architectures where signal integrity and power efficiency are paramount for sub-3 GHz frequency operations.
Consult official Infineon substitution guides for verified alternatives. Cross-reference technical specifications carefully to ensure compatibility with existing system requirements.
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