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BGS13SL9E6327XTSA1 is listed in the RF Switches range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC RF SWITCH SP3T 3GHZ TSLP9-3. Review the specifications below when checking this part for your BOM.
The BGS13SL9E6327XTSA1 is an SP3T RF switch IC manufactured by Infineon Technologies, designed for IoT and 5G applications. It operates within a frequency range of 0.1 GHz to 3.0 GHz. The device features a maximum input power of 32 dBm and requires a supply voltage between 1.65 V and 3.4 V. Typical isolation at 1 GHz is 40 dB, with an insertion loss of 0.21 dB at the same frequency. It utilizes GPIO control interfaces and is housed in a TSLP-9-3 package.
Verify the specific suffix E6327XTSA1 against official Infineon documentation to confirm package type and tape/reel specifications. Ensure compatibility with GPIO control logic levels specified in the datasheet. Confirm RoHS compliance status through manufacturer certificates prior to integration into final assemblies.
Select this component when designing circuits requiring SP3T switching functionality up to 3 GHz. Consider its low insertion loss and high isolation characteristics for signal integrity. Verify that the operating voltage range aligns with the system's power supply rails and that the GPIO interface matches the controller outputs.
This part belongs to Infineon’s portfolio of RF switches tailored for wireless connectivity. It complements other models like the BGS13SN8 and BGS12WN6, offering specific port configurations and frequency ranges suitable for modern mobile and IoT hardware architectures.
Public confirmed substitute part numbers are not available in the provided source material.
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