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BGS67A,112 is listed in the Video Amps And Modules range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC AMP CATV DMAN8. Review the specifications below when checking this part for your BOM.
The BGS67A,112 is a discontinued RF MOSFET transistor manufactured by NXP. It operates in the Ultra High Frequency band and utilizes Metal-Oxide Semiconductor technology in an enhancement mode configuration. The device features a single FET structure housed in a SOT467C flange mount package with a ceramic metal-sealed cofired body. Key electrical limits include a minimum drain-source breakdown voltage of 65 V and a maximum continuous drain current of 2.2 A. The component supports operation up to a maximum junction temperature of 200 °C and complies with EU RoHS standards.
This component is officially marked as No Longer Manufactured by NXP. Verification should confirm that the provided specifications are strictly for historical reference purposes. Procurement of new units is not supported; availability is limited to existing stock or secondary market sources. Designers must evaluate alternative active components for new production runs due to the discontinuation status.
Selection is restricted to legacy system maintenance or repair scenarios given the discontinued status. Engineers should verify compatibility with existing Ultra High Frequency requirements and ensure thermal management aligns with the 200 °C maximum operating temperature limit. Replacement strategies should prioritize active devices with similar SOT467C packaging and comparable 65 V breakdown voltage ratings.
The BGS67A,112 belongs to the NXP RF MOSFET Transistors product line. It is categorized under discrete semiconductors and transistors. The specific part number includes the '112' suffix indicating the tape and reel packaging format. This component represents a specialized solution for RF power applications requiring high-frequency performance and durable packaging.
No public confirmed substitute part numbers are available in the source material. Designers should consult NXP for current active alternatives suitable for Ultra High Frequency applications.
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