SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The BGSA132MN10E6327XTSA1 is an RF switch IC manufactured by Infineon Technologies, designed for wireless and radio frequency integrated circuit applications. It features a single-pole double-throw (SPDT) switch configuration utilizing silicon technology. The component operates within a frequency range from 400 MHz to 8.25 GHz. Key electrical specifications include a maximum insertion loss of 0.5 dB and typical off-isolation of 20 dB. It supports a supply voltage range between 1.2 V and 1.8 V with a working supply current of 22 uA. The device is housed in a TSLP-9-8 package and is rated for operation between -40 C and +85 C.
Verify the specific datasheet version and RoHS compliance status directly with Infineon or authorized distributors before finalizing procurement. Confirm that the TSLP-9-8 package dimensions match your PCB footprint requirements. Ensure that the supply voltage constraints align with your system's power management design. Check for any recent lifecycle updates or recommended replacement parts if this component is designated as obsolete or not recommended for new designs.
Select this component when a low-power SPDT switch is required for frequencies extending up to 8.25 GHz. Consider its small form factor and low current draw suitable for battery-operated portable electronics. Evaluate the trade-off between insertion loss and isolation against other available RF switches. Ensure compatibility with CMOS control logic levels typically found in modern mobile platforms.
This part belongs to Infineon's portfolio of wireless and RF integrated circuits, specifically targeting antenna management solutions. It complements other SPST and multi-throw switches in the BGSA series, offering specialized performance for high-frequency applications where power efficiency and compact size are critical design parameters.
Check official Infineon documentation for direct pin-compatible substitutes or updated series replacements. Verify if newer iterations offer improved isolation or lower loss characteristics while maintaining the same package outline.