BK20104S121-T

Overview

The BK20104S121-T is a multilayer chip ferrite bead array manufactured by Taiyo Yuden. It features four independent lines in an 0804 (2010 metric) surface-mount package with eight PCB pads. The component provides an impedance of 120 Ohms at 100 MHz and supports a maximum current rating of 100 mA. Its DC resistance is 300 milliohms, and it operates within a temperature range of -55°C to 125°C.

Feature Summary

• Four-line configuration for simultaneous noise suppression across multiple signal paths
• Compact 0804 footprint designed for high-density surface-mount applications
• High-impedance characteristics effective for broadband electromagnetic interference filtering

Applications

• Data line protection in portable electronic devices
• Noise suppression on clock signals in digital circuits
• EMI filtering in communication module interfaces

Procurement Notes

Verify the obsolete lifecycle status before procurement planning. Confirm that alternative components meet the required 100mA current rating and 120 Ohm impedance specifications. Ensure the 0804 package dimensions align with existing PCB footprints. Check RoHS compliance requirements against project standards.

Selection Notes

Select this component when space constraints require a compact 0804 package. Choose this part if four isolated channels are needed for differential or multi-signal filtering. Verify that the 100mA current handling capability matches the circuit load. Ensure the 300 milliohm DC resistance does not cause excessive voltage drop in the application.

Part Context

This component belongs to the BK series of multilayer chip bead arrays from Taiyo Yuden. These components utilize ceramic technology to provide stable frequency-dependent impedance. The series is designed for general-purpose EMI suppression in consumer electronics and industrial equipment where small form factors are critical.

Replacement Considerations

The BLA31AG121SN4D by Murata Electronics is listed as a direct substitute. Verify compatibility regarding package size and electrical parameters before substitution.