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BK32164S121-T is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is FERRITE BEAD 120 OHM 1206 1LN. Review the specifications below when checking this part for your BOM.
The BK32164S121-T is a multilayer ferrite chip bead array manufactured by Taiyo Yuden. It features four independent lines housed in a 1206 (3216 metric) surface-mount package with dimensions of 3.20mm x 1.60mm x 0.90mm. The component provides an impedance of 120 Ohms at a test frequency of 100 MHz. It supports a maximum DC current of 200 mA and has a maximum DC resistance of 180 milliohms. The device operates within a temperature range of -55°C to +125°C.
Verify the specific suffix 'S' against the target design, as it denotes the 200mA current rating variant distinct from other series members like 'M' or 'W'. Confirm availability status as multiple distributors list this part as discontinued or obsolete. Ensure the selected substitute matches the 1206 footprint and 120 Ohm impedance specifications to maintain circuit performance without redesign.
Select this component when four-channel noise filtering is required in a constrained 1206 area. The 200mA current rating suits moderate-power digital signals. Compare DCR values against power loss constraints. Verify that the 120 Ohm impedance at 100 MHz aligns with the target noise spectrum. Consider the -55°C to +125°C operating range for industrial or automotive environments if applicable.
This part belongs to the BK Array series of multilayer ferrite bead inductors. These components are engineered to suppress electromagnetic interference in compact electronics. The BK series utilizes proprietary ceramic materials to achieve high impedance characteristics while maintaining low DC resistance. This specific model represents a quad-line configuration optimized for multi-signal bus applications.
The Murata BLA31AG121SN4D is identified as a direct replacement alternative. Verify that the substitute maintains the 1206 footprint, 120 Ohm impedance, and compatible current handling capabilities before integration.
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