BK32164S301-T

Chip Ferrite Bead Overview

The BK32164S301-T is a multilayer ferrite chip bead manufactured by Taiyo Yuden, designed for surface-mount applications in the 1206 (3216 metric) package. It features an impedance of 300 Ohms at 100 MHz with a tolerance of 25%. The component supports a maximum DC current of 200 mA and has a maximum DC resistance of 450 milliohms. It operates within a temperature range of -55°C to +125°C and contains four independent lines.

Chip Ferrite Bead Feature Summary

• Multilayer construction providing high-density filtering capabilities
• Four independent channels for multi-line signal suppression
• Low DC resistance to minimize power loss in power lines

Chip Ferrite Bead Applications

• High-speed data line noise suppression
• Power supply line filtering
• EMI suppression in portable devices

Chip Ferrite Bead Procurement Notes

Verify the specific suffix 'S' against the official datasheet to confirm it denotes the 200 mA rating variant, as other series members like 'M' may have different current limits. Confirm RoHS compliance status and check for obsolescence notices, as similar parts in this family have been marked obsolete in recent distributor records.

Chip Ferrite Bead Selection Notes

Select this part when a 300 Ohm impedance at 100 MHz is required for four-channel filtering in a compact 1206 footprint. Ensure the circuit current does not exceed 200 mA to prevent saturation or excessive heating. Verify that the low DC resistance meets the voltage drop requirements of the application.

Chip Ferrite Bead Part Context

This component belongs to the BK Array series from Taiyo Yuden, which offers integrated ferrite beads for space-constrained designs. The 1206 package allows for automated surface-mount assembly, making it suitable for consumer electronics and industrial equipment requiring efficient EMI management without occupying significant PCB area.

Chip Ferrite Bead Replacement Considerations

Direct substitutes include Murata BLA31AG121SN4D, which shares similar impedance and package dimensions. Verify electrical parameters and pin configuration compatibility before substitution.