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BKH1005LM152-T is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Taiyo Yuden. Its product description is FERRITE BEAD 1.5 KOHM 0402 1LN. Review the specifications below when checking this part for your BOM.
The BKH1005LM152-T is a multilayer chip bead inductor from the Taiyo Yuden BK series H type. It features a 0402 (1005 metric) surface-mount package with dimensions of 1.00mm x 0.50mm and a maximum height of 0.55mm. The component provides an impedance of 1.5 kOhms at 100 MHz with a tolerance of 25%. It supports a maximum DC current of 200 mA and has a maximum DC resistance of 1.5 ohms. The device operates within a temperature range of -55°C to +125°C.
This component is officially discontinued and no longer manufactured by Taiyo Yuden. Verification of availability should focus on obsolete inventory or authorized distributors holding remaining stock. Buyers must confirm end-of-life status and ensure that any sourced units match the original RoHS3 compliance and packaging specifications. Replacement strategies should be prioritized due to supply chain unavailability.
Designers should evaluate alternative components due to the obsolete status of this part. Key selection criteria include matching the 1.5 kOhm impedance at 100 MHz, maintaining the 200 mA current rating, and ensuring compatibility with the 0402 package size. Thermal performance requirements must align with the -55°C to +125°C operating range. Cross-referencing with active series parts is recommended to maintain long-term production viability.
The BKH1005LM152-T belongs to the BK series H type multilayer chip bead inductors produced by Taiyo Yuden. This series is engineered for high-temperature applications, distinguishing it from standard ferrite beads. The component utilizes monolithic ceramic technology to provide effective electromagnetic interference suppression in small form factors common in modern electronics.
The TDK MMZ1005A152ET000 is documented as a direct substitute. Both parts share identical impedance characteristics and package dimensions, facilitating potential board-level swaps without layout modifications.
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