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BL 1 23 G is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Stamped contact spring (fork con. Review the specifications below when checking this part for your BOM.
The Fischer Elektronik BL 1 23 G is a 23-position female header connector designed for through-hole mounting on printed circuit boards. It features a standard 2.54 mm (0.100 inch) pitch between contacts, ensuring compatibility with common PCB layouts. The connector utilizes gold-plated contacts made from a CuSn alloy to provide reliable electrical performance and corrosion resistance. The housing is engineered to accept square profile pins with a diameter of 0.635 mm, utilizing a stamped contact spring design.
Verify the specific ordering suffix 'G' corresponds to the required gold plating finish as documented in the official datasheet. Confirm that the 23-position count matches the design requirements. Ensure the through-hole footprint aligns with the manufacturing capabilities of the target PCB. Cross-reference the pin profile compatibility to guarantee mechanical fit within the assembly constraints.
Select this component when a 23-position female header with gold contacts is required for through-hole applications. The 2.54 mm pitch suits standard spacing requirements. Consider the 0.635 mm pin acceptance limit for mating hardware. Evaluate the CuSn alloy construction for environmental durability needs compared to alternative finishes.
This part belongs to the Fischer Elektronik BL 1 series of female headers. The series offers various position counts ranging from low to high density configurations. All variants share the same fundamental design principles regarding contact geometry and mounting style, differing primarily in the number of positions available for specific circuit routing needs.
Direct substitutes must maintain the 23-position count, 2.54 mm pitch, and gold-plated contact specification. Verify mechanical compatibility with the 0.635 mm pin profile. Ensure the replacement part supports through-hole soldering methods identical to the original design intent.
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