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BLM15HB121SN1D is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is FERRITE BEAD 120 OHM 0402 1LN. Review the specifications below when checking this part for your BOM.
The Murata BLM15HB121SN1D is a surface-mount ferrite bead in the EMIFIL BLM15H series, designed for high-frequency noise suppression. It features an impedance of 120 Ohms at 100 MHz with a tolerance of ±25%. The component supports a maximum DC current of 300 mA and exhibits a maximum DC resistance of 170 mOhms. Housed in a compact 0402 (1005 metric) package measuring 1 mm x 0.5 mm x 0.5 mm, it operates reliably within a temperature range of -55°C to +125°C.
Verify the specific suffix SN1D against official Murata documentation to confirm packaging configuration. Ensure the selected variant matches the required 0402 footprint and electrical ratings for your circuit design. Cross-reference datasheets from authorized distributors to validate current availability and lead times before finalizing procurement plans.
Select this component when space constraints require a 0402 footprint for noise filtering applications. The 300 mA current rating suits low-power signal lines rather than high-current power rails. Consider the 120 Ohm impedance value for target frequency ranges around 100 MHz. Verify that the low DC resistance meets voltage drop requirements for the specific application circuit.
This part belongs to the Murata EMIFIL BLM15H series of multi-layer ferrite beads. These components are engineered to suppress noise in GHz frequency bands while minimizing resonance risks. The series offers various impedance values and current ratings within standard EIA sizes, providing designers with flexible options for EMI control in compact consumer and industrial electronics.
Direct substitutes include other Murata BLM15H series parts with identical 120 Ohm impedance and 0402 dimensions but different current ratings, such as BLM15HG or BLM15HH variants. Ensure any replacement maintains the same package size and thermal characteristics to fit existing footprints.
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