BLM18BD221SH1D

Chip Ferrite Bead Overview

The Murata BLM18BD221SH1D is a single ferrite chip bead in the BLM18BD series, housed in a 0603 (1608 metric) surface-mount package measuring 1.6 mm x 0.8 mm x 0.6 mm. It provides an impedance of 220 Ohms at a test frequency of 100 MHz with a tolerance of 25%. The component supports a maximum DC current of 200 mA and has a maximum DC resistance of 450 mOhms. It operates within a temperature range of -55°C to +125°C.

Chip Ferrite Bead Feature Summary

• Provides high-frequency noise suppression through ferrite material properties
• Designed for surface-mount assembly on printed circuit boards
• Compact physical dimensions suitable for space-constrained layouts

Chip Ferrite Bead Applications

• High-speed data line filtering
• Power supply noise attenuation
• General-purpose EMI suppression in electronic circuits

Chip Ferrite Bead Procurement Notes

Verify the specific suffix SH1D against official Murata documentation to confirm the exact height and termination specifications. Ensure the required operating temperature range and current ratings align with the design constraints before ordering. Cross-reference the impedance value at the target frequency to validate performance requirements.

Chip Ferrite Bead Selection Notes

Select this component when a low-profile 0603 footprint is required with moderate current handling capabilities. The 220 Ohm impedance offers effective attenuation for specific noise frequencies. Consider the 200 mA current limit to prevent saturation or excessive heating in the application circuit.

Chip Ferrite Bead Part Context

This part belongs to the BLM18BD series of ferrite beads from Murata Electronics. The series utilizes specialized ferrite materials optimized for broadband noise absorption. The 0603 form factor allows for automated placement and integration into modern compact electronic devices.

Chip Ferrite Bead Replacement Considerations

Check for parts with identical 220 Ohm impedance and compatible current ratings. Verify that substitute components match the 0603 footprint and height constraints. Confirm thermal performance and material compatibility with the intended assembly process.