BLM21BB600SN1D

Chip Ferrite Bead Overview

The Murata BLM21BB600SN1D is a single-line ferrite chip bead in an 0805 (2012 metric) surface-mount package. It provides 60 Ohms impedance at 100 MHz with a 25% tolerance. The component supports a maximum DC current of 800 mA and has a maximum DC resistance of 130 mOhms. It operates within a temperature range of -55°C to +125°C, measuring 2 mm in length, 1.25 mm in width, and 0.85 mm in height.

Chip Ferrite Bead Feature Summary

• Provides high-frequency noise suppression for signal lines through ferrite material absorption.
• Designed for surface-mount assembly in compact electronic circuits.
• Maintains stable electrical characteristics across a wide industrial temperature range.

Chip Ferrite Bead Applications

• High-speed signal line filtering
• EMI suppression filters

Chip Ferrite Bead Procurement Notes

Verify the specific suffix SN1D against official Murata documentation to confirm packaging type and tape specifications. Ensure the selected variant matches the required impedance tolerance and current rating for the target circuit design before finalizing procurement orders.

Chip Ferrite Bead Selection Notes

Select this component when a 60 Ohm impedance at 100 MHz is required for EMI suppression in space-constrained designs. Verify that the 800 mA current rating exceeds the maximum operating current of the protected signal line to prevent saturation or excessive heating during normal operation.

Chip Ferrite Bead Part Context

This part belongs to the BLM21 series of ferrite beads manufactured by Murata Electronics. The series offers various impedance values and current ratings within the standard 0805 footprint, allowing designers to customize noise filtering performance while maintaining consistent board layout dimensions across different product families.

Chip Ferrite Bead Replacement Considerations

Consult official Murata substitution guides for verified equivalents. Cross-referencing requires matching impedance, current rating, and physical dimensions to ensure functional compatibility without redesigning the PCB footprint.