SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
BLN1608LL30R2400A is listed in the Balun range at ChipApex. The manufacturer field lists Pulse Electronics. Its product description is BALUN 2.4GHZ. Review the specifications below when checking this part for your BOM.
The BLN1608LL30R2400A is a surface-mount RF balun manufactured by Pulse Electronics, designed for signal conditioning in wireless applications. It operates within a frequency range of 2.4 GHz to 2.5 GHz and provides an impedance transformation from 50 Ohms unbalanced to 50 Ohms balanced. The component utilizes a 0603 (1608 metric) package with a six-pad configuration for board mounting. Key electrical specifications include a maximum insertion loss of 1.4 dB and a minimum return loss of 10 dB. The phase difference is specified at 180° ±10°. It functions reliably across an operating temperature range of -40°C to +85°C.
Verify the specific datasheet revision when sourcing, as manufacturer documentation may update mechanical or electrical tolerances over time. Confirm that the 0603 package dimensions align with your PCB land pattern design, particularly regarding the six-pad configuration. Ensure that the 50-ohm to 50-ohm impedance match meets your system requirements, as some variants offer different impedance ratios. Check RoHS compliance status if required by your manufacturing standards.
Select this component when a compact solution is needed for 2.4 GHz wireless systems requiring balanced output. The 0603 size offers a balance between performance and board space efficiency compared to larger packages. Consider the 1.4 dB insertion loss limit when designing for high-efficiency power transmission. The wide operating temperature range makes it suitable for industrial environments where thermal stability is critical for consistent RF performance.
This balun belongs to Pulse Electronics' line of passive RF components for wireless connectivity. It complements diplexers and filters in complete RF front-end assemblies. The 1608 series indicates the standardized metric footprint size. These components are essential for maintaining signal integrity in modern wireless protocols that rely on differential signaling for noise immunity and reduced electromagnetic interference.
Direct substitutes must match the 0603 footprint, 2.4-2.5 GHz frequency range, and 50/50 ohm impedance ratio. Verify that alternative baluns maintain similar insertion loss and phase balance specifications. Mechanical compatibility requires checking pad layout and solder mask definitions. Electrical equivalence ensures no degradation in signal quality or power handling capabilities.
Explore related parts through RF and Wireless, all product categories, ChipApex homepage.