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The BM64374S-VA is a three-phase inverter Intelligent Power Module (IPM) manufactured by ROHM Semiconductor. It integrates IGBT power devices with gate drivers and protection circuits within a 25-PowerDIP package. The module supports a collector-emitter maximum voltage of 600 V and a continuous collector current of 15 A at 25°C. Key electrical parameters include a saturation voltage of 1.7 V, power dissipation of 41 W, and an isolation voltage of 1500 Vrms. Operating temperatures range from -25°C to +115°C.
Verify the specific datasheet revision and RoHS compliance status before integration. Confirm that the HSDIP-25 through-hole mounting style matches the target PCB layout. Ensure thermal management solutions accommodate the specified 41 W power dissipation and operating temperature limits. Check for any recent product change notices affecting pinouts or electrical characteristics.
Select this IPM when a compact solution for three-phase control is required without discrete component complexity. The 600V rating suits standard industrial bus voltages. Consider the 15A current capacity against load requirements. The integrated protections simplify design compared to discrete IGBT stacks. Verify compatibility with 3.3V or 5V logic interfaces if applicable to the broader family.
This component belongs to the ROHM BM64 series of intelligent power modules designed for general-purpose inverter applications. It consolidates power switching and control logic into a single package to reduce board space and assembly time. The series typically targets industrial automation and consumer appliance motor control markets.
Publicly documented parameter-equivalent substitutes include the BM63364S-VA, BM63374S-VA, BM63564S-VA, BM63574S-VA, BM63764S-VA, and BM63964S-VA. Verify specific current ratings and thermal performance differences before substitution.
The module provides an isolation voltage of 1500 Vrms between the power terminals and the control circuit pins.
Yes, the integrated gate driver includes a thermal shutdown (TSD) function that activates to protect the module from excessive heat.
The low-side IGBTs feature an open emitter configuration, allowing for external current sensing connections.