BMB2A0300BN3

Chip Ferrite Bead Overview

The BMB2A0300BN3 is a single-line ferrite bead from the BMB-L series, manufactured by TE Connectivity Passive Product. It features a 0805 (2012 Metric) surface-mount package with dimensions of 0.079 inches in length and 0.047 inches in width. The component provides an impedance of 300 Ohms at 100 MHz and has a maximum DC resistance of 500 milliohms. It supports a rated current of 200 mA and operates within a temperature range of -55°C to 125°C.

Chip Ferrite Bead Feature Summary

• Provides high-frequency noise suppression through specific impedance characteristics at 100 MHz
• Designed for surface-mount assembly in compact electronic circuits
• Constructed for reliable operation across a wide industrial temperature range

Chip Ferrite Bead Applications

• High-frequency noise suppression in signal lines
• EMI filtering in portable electronic devices
• Power line conditioning in compact circuit boards

Chip Ferrite Bead Procurement Notes

Verify the exact suffix designation against official TE Connectivity documentation, as variations such as BN3 may indicate specific packaging or material configurations that do not alter electrical function but affect logistics. Confirm availability status directly with authorized distributors, as this part number may be subject to discontinuation or lifecycle changes. Ensure compatibility with existing PCB footprints and reflow soldering profiles specified in the datasheet.

Chip Ferrite Bead Selection Notes

Select this component when a 300 Ohm impedance at 100 MHz is required for EMI suppression in space-constrained designs. The 0805 package offers a balance between current handling capability and board area efficiency. Consider the 200 mA rated current limit to ensure the component does not saturate under normal operating conditions. Verify that the 500 milliohm DC resistance meets the voltage drop requirements of the target circuit.

Chip Ferrite Bead Part Context

This ferrite bead belongs to the BMB-L series, which is designed for general-purpose EMI suppression applications. The series utilizes advanced ceramic materials to provide stable impedance characteristics over temperature and frequency ranges. The BMB2A0300BN3 variant specifically targets applications requiring moderate current handling with precise high-frequency attenuation capabilities in standard surface-mount layouts.

Chip Ferrite Bead Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Consult TE Connectivity technical support for qualified alternatives if this component is discontinued or unavailable.