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The BMS1609F-11C-07H03-DS is a surface-mount board-to-board connector manufactured by BeStar Technologies, Inc. It features a 1.25mm pitch and consists of 7 positions arranged in a single row. The component utilizes a gold-plated contact finish to ensure reliable signal transmission and corrosion resistance. Designed for high-density electronic assemblies, it supports a rated current of 1A per contact and withstands voltages up to 50V DC. The housing is constructed from UL94V-0 rated PBT material, providing thermal stability and mechanical durability for automated pick-and-place assembly processes.
Verify the specific suffix codes against official manufacturer documentation to confirm exact plating thickness and mating cycle ratings. Ensure compatibility with existing PCB footprint dimensions and reflow soldering profiles before finalizing procurement orders.
Select this component when space constraints require a low-profile solution with a 1.25mm pitch. Confirm that the operating environment does not exceed the specified voltage and current limits. Validate that the mating connector series matches the housing style and retention mechanism requirements.
This part belongs to the BMS series of surface-mount connectors designed for high-reliability applications. The series offers various pin counts and configurations to accommodate different density requirements within modern electronic devices.
Consult official cross-reference lists for verified substitutes. Generic equivalents may differ in mating force or retention strength.