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The BPF-C587+ is a lumped LC bandpass filter manufactured by Mini-Circuits, designed for surface-mount applications. It operates within a frequency range of 470 MHz to 705 MHz, providing a bandwidth of 235 MHz with a center frequency of 587 MHz. The component features a 50-ohm impedance and utilizes an HU1186 case style package. Key electrical specifications include an insertion loss of 2.5 dB. It is rated for operation between -40°C and +85°C, ensuring reliability in various environmental conditions.
Verify the specific ordering suffix and packaging configuration against official Mini-Circuits documentation before procurement. Confirm that the HU1186 package dimensions align with your PCB layout requirements. Ensure compatibility with standard SMD/SMT reflow processes. Cross-reference the datasheet revision date to guarantee access to the most current electrical parameters and mechanical drawings for accurate integration.
Select this component when a fixed center frequency of 587 MHz is required with a 235 MHz bandwidth. The 2.5 dB insertion loss makes it suitable for applications where moderate signal attenuation is acceptable. The wide operating temperature range supports deployment in industrial or outdoor environments. Verify that the lumped LC topology meets the phase linearity and harmonic rejection needs of the specific circuit design.
Mini-Circuits specializes in RF, IF, and microwave components ranging from DC to 86 GHz. The BPF series represents their surface-mount bandpass filter offerings, utilizing compact packages like the HU1186. These filters are engineered for high performance in signal processing applications, supporting industries such as wireless communications, industrial control, and medical electronics through standardized, reliable component designs.
Consult Mini-Circuits official substitution guides for equivalent lumped LC bandpass filters. Verify that any alternative maintains the 470-705 MHz passband and 50-ohm impedance. Ensure physical footprint compatibility with the HU1186 package to avoid PCB redesign.