BPF-F100+

Overview

The BPF-F100+ is a surface-mount bandpass filter from Mini-Circuits, designed for RF signal conditioning. It operates with a center frequency of 100 MHz and provides a bandwidth of 10 MHz, covering the range from 95 to 105 MHz. The component features a standard 50-ohm impedance and utilizes lumped LC technology within a shielded SMD package. Key electrical specifications include a typical insertion loss of 6 dB and attenuation levels of 35 dB at specified stopband frequencies (DC-85 MHz and 120-900 MHz). The unit measures 1.360 x 0.762 x 0.457 mm.

Feature Summary

• Shielded surface-mount construction for EMI/RFI suppression
• Lumped LC design for precise frequency selection
• Standard 50-ohm impedance matching

Applications

• EMI and RFI filtering in electronic circuits
• Power line filtering applications
• RF signal conditioning modules

Procurement Notes

Verify the specific datasheet version when sourcing, as Mini-Circuits may update mechanical dimensions or electrical tolerances over time. Confirm that the 18-SMD no-lead package footprint matches your PCB layout requirements. Ensure the operating environment remains within the specified temperature range to maintain the stated insertion loss and attenuation characteristics. Cross-reference the part number suffix to confirm RoHS compliance status if required by your manufacturing standards.

Selection Notes

Select this component when a narrow 10 MHz bandwidth centered at 100 MHz is required for interference rejection. The shielded SMD package makes it suitable for dense PCB layouts where electromagnetic isolation is critical. Consider the 6 dB insertion loss impact on system gain budget. This filter is appropriate for applications requiring suppression of out-of-band signals below 85 MHz and above 120 MHz while passing the desired 100 MHz carrier.

Part Context

Mini-Circuits manufactures a broad portfolio of passive RF components, including LTCC filters and power dividers. The BPF-F100+ belongs to their surface-mount bandpass filter series, which utilizes lumped LC technology. These components are designed for compact integration into wireless communication systems, test equipment, and industrial control units, supporting signal integrity through effective harmonic and clutter suppression.

Replacement Considerations

No public substitute part numbers are confirmed in the available documentation.