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The BSM50GD120DN2G is a 3-phase full-bridge IGBT power module from Infineon Technologies, housed in an EconoPACK 3 package with an insulated metal base plate. It integrates fast free-wheel diodes and supports a collector-emitter voltage of 1200 V. The DC collector current is rated at 50 A at TC = 80 °C and 78 A at TC = 25 °C. Maximum ratings include a gate-emitter voltage of ± 20 V, a maximum junction temperature of + 150 °C, and a storage temperature range of -40 to + 125 °C. Electrical characteristics specify a gate threshold voltage between 4.5 V and 6.5 V, and a collector-emitter saturation voltage of 2.5 V to 3.7 V at IC = 50 A.
Verify the exact ordering code C67070-A2521-A67 against official Infineon documentation before procurement. Confirm that the component meets specific insulation test voltage requirements of 2500 Vac for one minute. Ensure thermal management solutions are compatible with the specified chip-to-case thermal resistance values.
Select this module for applications requiring a 1200 V rating and up to 78 A continuous current capability. Evaluate the switching times and reverse recovery charge of the integrated diodes against the target operating frequency. Verify that the gate drive circuitry can accommodate the specified threshold voltage range and leakage currents under varying temperature conditions.
This component belongs to the BSM series of IGBT modules originally developed by Siemens and later managed by EUPEC before becoming part of Infineon Technologies. The 'DN2' suffix typically denotes specific switching characteristics within this product family. The module utilizes silicon technology and is designed for high-power industrial applications.
BSM50GD120DN2